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The Backbone of Quantum Computing

Quantum processors are among the most advanced technologies in existence, capable of solving problems that classical computers struggle with. But their operation depends on conditions that are far from ordinary. To preserve quantum coherence and suppress thermal noise, these devices must be cooled to millikelvin temperatures just fractions of a degree above absolute zero.

Achieving these temperatures requires a dilution refrigerator, a specialized system that uses helium-3 and helium-4 isotopes to reach cryogenic levels. The quantum processor is mounted deep within the refrigerator, where it is shielded from heat, vibration, and electromagnetic interference.

Why Sealing Matters

While cooling is essential, it’s the vacuum-sealed environment that makes it all possible. The refrigerator must remain completely isolated from the outside world to prevent helium leakage and maintain stable cryogenic conditions. Even a microscopic breach can disrupt the delicate balance, affecting both temperature and signal fidelity.

This presents a unique engineering challenge: scientists need to send and receive signals from the quantum processor, but any physical connection risks compromising the vacuum. The solution must allow for high-frequency RF communication while preserving the integrity of the sealed environment.

Bridging the Gap with Precision Engineering

To address this, researchers rely on hermetic feedthrough specialized connectors designed to pass signals through the refrigerator wall without allowing any gas exchange. These components are critical for enabling control and readout of quantum devices while maintaining the vacuum seal.

One such solution is Amphenol CDI’s Hermetic Interposer, which is engineered specifically for quantum applications. It allows scientists to route a large number of RF lines into and out of the dilution refrigerator, supporting complex experiments and device characterization. By combining airtight sealing with high signal performance, it plays a quiet but essential role in advancing quantum research. If you'd like to learn more about the hermetic interposer and its capabilities, visit our product webpage.

In the pursuit of scalable quantum computing, every detail matters and maintaining vacuum integrity is one of the most important foundations of reliable operation.

As quantum computing systems mature, the requirements placed on interconnect hardware have become increasingly stringent. Cryogenic environments demand materials and structures that maintain both electrical and mechanical integrity at extremely low temperatures. Equally critical is the elimination of magnetic influence: even minimal magnetic fields can perturb qubits, distort instrument readings, or introduce instability into highly sensitive RF chains.

To support next‑generation quantum platforms, Amphenol has developed CoreCryo™, the cryogenic, non‑magnetic extension of our proven CoreHC™ connector family. CoreCryo™ preserves the performance, density, and serviceability that CoreHC™ is known for, while introducing the material, mechanical, and thermal refinements required for quantum‑grade operation.

Why Non‑Magnetic Components Are Essential?

Quantum processors—particularly those based on superconducting, spin, or magnetically sensitive architectures—operate in environments where magnetic susceptibility must be tightly controlled. Even trace magnetic materials in connector shells, fasteners, or signal paths can lead to:

• Shifts in qubit operating points
• Reduced coherence times
• Degraded measurement fidelity
• Disturbances to sensitive cryogenic instruments or magnetometers

To maintain operational stability, all hardware interfacing with cryogenic PCBs and RF chains must be demonstrably non‑magnetic and verified to remain so throughout thermal cycling.

Introducing CoreCryo™

CoreCryo™ is Amphenol’s cryogenic, non‑magnetic variant of the CoreHC product line, designed for reliable RF and power transitions into PCB assemblies used in quantum computing and cryo‑sensitive instrumentation. The platform combines enhanced material selection, cryogenic‑specific mechanical engineering, and RF‑optimized geometry to deliver stable performance at millikelvin temperatures.

Key Capabilities

Non‑Magnetic Construction

All magnetic materials have been fully removed from the CoreCryo™ signal path, connector shell, and associated fasteners.
Non‑magnetic alloys and plating systems are used throughout, ensuring minimal stray fields that could interfere with qubits or sensitive magnetometers.

Cryogenic Mechanical Robustness

CoreCryo™’s mechanical design directly accounts for:

• Extreme thermal contraction
• Repeated cooldown and warmup cycles
• Mechanical stresses within dilution and closed‑cycle refrigerators

Contacts, insulators, and sealing elements are specifically selected to maintain consistent contact force and electrical continuity at low temperatures.

Preserved RF Performance

CoreCryo™ retains the RF behavior that makes CoreHC a trusted platform:

• Controlled impedance launches
• Stable VSWR & insertion loss
• Predictable S‑parameters for cryogenic RF chains

This allows quantum system designers to meet tight RF budgets without compromise.

High Density and Serviceability

With CoreHC’s compact 2.5 mm pitch and modular inserts, CoreCryo™ provides:

• High channel density
• Mixed power and signal configurations
• Efficient routing in space‑constrained cryostat enclosures

The architecture supports rapid assembly, replacement, and testing—critical in research and production environments alike.

Validation and Testing Status

Amphenol is actively conducting comprehensive environmental and lifecycle qualification for CoreCryo™, including:

• Repeated cryogenic cooldown/warmup cycles
• Thermal shock exposure
• Contact endurance at cryogenic temperatures
• Magnetic susceptibility verification

Results will be published and made available to partners and evaluators as testing progresses.

See CoreCryo™ at APS Global Physics Summit 2026

CoreCryo™ prototypes will be demonstrated at the APS March Meeting 2026, where quantum computing integrators and system architects can review the technology firsthand.

To request:

• Evaluation samples
• S‑parameter files
• Recommended footprints
• Integration guidance tailored to your temperature range, frequency band, and termination style

Please contact us at support@amphenolcdi.com to learn more. Our team will provide complete technical support to accelerate your design cycle and ensure optimal performance in your cryogenic system.